It is an exciting time for the U.S. defense related electronics industry. Aside from the CHIPS Act related activities DoD has already has a number of initiatives underway. Everything from the recent Presidential Determination on printed circuit boards and advanced packaging for the Defense Production Act, to several other emerging activities. Join this USPAE member forum to hear directly from Anthony Di Stasio, DoD’s Director for Manufacturing, Capability Expansion And Investment Prioritization (MCEIP), on the latest activities and his vision for the PCB and advanced packaging industries.

Register Here: https://ati.zoomgov.com/meeting/register/vJItcemppj4jE85_aFULvLw-Z-j7JZ4OmOY