The Department of Defense (DoD) has tasked USPAE with studying and recommending an approach to address the country’s lack of manufacturing capability for Ultra High-density Interface (UHDI) and and Integrated Circuit (IC) substrate products. USPAE has already led several workshops attended by industry and government leaders to lay the foundation for this effort.

The project kicked off in October and is being fast-tracked to deliver results quickly. Led by industry veteran Joe O’Neil, the project team is just beginning to gather stakeholder input that will help shape the recommendations. Information is needed on current and planned capabilities, projected demand, supply chain challenges and much more.

If you would like to provide information that you believe would be useful in this effort, please CLICK HERE TO BE TAKEN TO THE COMPLETE SURVEY or complete the form below and the project team will follow up with you to gather more details. Information received will only be used in aggregate unless you wish to have your name associated with the insights provided.