Defense Manufacturing Conference

Tampa Convention Center, Tampa, FL

DMC is the nation’s annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. Leaders and manufacturing subject matter experts from government, industry, and academia exchange information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.

Parts and Material Management Conference

Hyatt Regency Savannah, GA 2 West Bay St., Savannah, GA, United States

USPAE will attend the Parts and Material Management Conference, which brings together government, industry and academia to address various issues around Diminishing Manufacturing Sources and Material Shortage along with parts management. USPAE members also will present an update on the Solder Performance and Reliability Assurance project, currently funded through the Defense Electronics Consortium.

Webinar Forum: New opportunity to strengthen U.S. PCB industry

USPAE has been leading an effort with industry and government to develop a solution to quickly deliver advanced capabilities to the domestic PCB industry. This effort, temporarily named “NewCo” for new company, is a unique public-private partnership designed to quickly put domestic PCB capabilities on a par with those of foreign regions. Join this USPAE member forum to learn more about what NewCo is, how it can help the entire U.S. PCB industry and how you can get involved.


Town and Country San Diego San Diego, CA, United States

In March, we will be at GOMACTech in San Diego. GOMACTech has focused on advances in electronics systems for the DoD and other government agencies. This conference also has a significant government participation and has been used to announce major government microelectronics initiatives.

USPAE Forum: DoD’s Anthony Di Stasio to brief members on new PCB and Advanced Packaging programs

It is an exciting time for the U.S. defense related electronics industry. Aside from the CHIPS Act related activities DoD has already has a number of initiatives underway. Everything from the recent Presidential Determination on printed circuit boards and advanced packaging for the Defense Production Act, to several other emerging activities. Join this USPAE member forum to hear directly from Anthony Di Stasio, DoD’s Director for Manufacturing, Capability Expansion And Investment Prioritization (MCEIP), on the latest activities and his vision for the PCB and advanced packaging industries.

USPAE Member Forum

There are many DoD needs and opportunities, especially for the electronics defense industry, yet engaging with the DoD technology ecosystem can be perplexing. Don’t miss the chance to hear from the Department of Navy (DoN) Office of Small Business Programs on how to actively engage with the technology ecosystems, making connections with DoN offices, finding the opportunities, and many other defense industry base support mechanisms. Dan Sheridan is currently on rotation to the DoN Office of Small Business Programs as the “on-staff entrepreneur,” and has also served as the NAVSEA Director of Integrated Enterprise Plan. Mr. Sheridan actively engages with the defense industrial base and DoN acquisition communities to creatively overcome hurdles and ensure that our defense systems are using the best technology available.

USPAE Member Meeting

Crystal City Marriott at Reagan National Airport 1999 Richmond Highway, Arlington, VA

All industry members and government are invited to join us [...]

NDIA Manufacturing Division Meeting

Washington, DC

Topics include supply chain risk management, workforce development, advanced manufacturing, research and engineering, and future focus.

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