The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications.

DSI’s Inaugural Assured Microelectronics Summit will bring together members of the DoD, US Government, and Industry to focus on the technologies and policies needed to enhance microelectronics capabilities in support of increased supply chain resilience & overall national security efforts.

DMC is the nation’s annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. Leaders and manufacturing subject matter experts from government, industry, and academia exchange information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.