• IPC Advanced Packaging Symposium

    Kimpton Hotel Monaco 700 F St NW, Washington D.C., United States

    The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications.

  • Assured Microelectronics Summit

    American Institute of Architects HQ Washington D.C., United States

    DSI’s Inaugural Assured Microelectronics Summit will bring together members of the DoD, US Government, and Industry to focus on the technologies and policies needed to enhance microelectronics capabilities in support of increased supply chain resilience & overall national security efforts.

  • Defense Manufacturing Conference

    Tampa Convention Center, Tampa, FL

    DMC is the nation’s annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. Leaders and manufacturing subject matter experts from government, industry, and academia exchange information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.

  • Parts and Material Management Conference

    Hyatt Regency Savannah, GA 2 West Bay St., Savannah, GA, United States

    USPAE will attend the Parts and Material Management Conference, which brings together government, industry and academia to address various issues around Diminishing Manufacturing Sources and Material Shortage along with parts management. USPAE members also will present an update on the Solder Performance and Reliability Assurance project, currently funded through the Defense Electronics Consortium.

  • Webinar Forum: New opportunity to strengthen U.S. PCB industry

    USPAE has been leading an effort with industry and government to develop a solution to quickly deliver advanced capabilities to the domestic PCB industry. This effort, temporarily named “NewCo” for new company, is a unique public-private partnership designed to quickly put domestic PCB capabilities on a par with those of foreign regions. Join this USPAE member forum to learn more about what NewCo is, how it can help the entire U.S. PCB industry and how you can get involved.

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