The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications.

DSI’s Inaugural Assured Microelectronics Summit will bring together members of the DoD, US Government, and Industry to focus on the technologies and policies needed to enhance microelectronics capabilities in support of increased supply chain resilience & overall national security efforts.

DMC is the nation’s annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. Leaders and manufacturing subject matter experts from government, industry, and academia exchange information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.

USPAE will attend the Parts and Material Management Conference, which brings together government, industry and academia to address various issues around Diminishing Manufacturing Sources and Material Shortage along with parts management. USPAE members also will present an update on the Solder Performance and Reliability Assurance project, currently funded through the Defense Electronics Consortium.

USPAE has been leading an effort with industry and government to develop a solution to quickly deliver advanced capabilities to the domestic PCB industry. This effort, temporarily named “NewCo” for new company, is a unique public-private partnership designed to quickly put domestic PCB capabilities on a par with those of foreign regions. Join this USPAE member forum to learn more about what NewCo is, how it can help the entire U.S. PCB industry and how you can get involved.

In March, we will be at GOMACTech in San Diego. GOMACTech has focused on advances in electronics systems for the DoD and other government agencies. This conference also has a significant government participation and has been used to announce major government microelectronics initiatives.

It is an exciting time for the U.S. defense related electronics industry. Aside from the CHIPS Act related activities DoD has already has a number of initiatives underway. Everything from the recent Presidential Determination on printed circuit boards and advanced packaging for the Defense Production Act, to several other emerging activities. Join this USPAE member forum to hear directly from Anthony Di Stasio, DoD’s Director for Manufacturing, Capability Expansion And Investment Prioritization (MCEIP), on the latest activities and his vision for the PCB and advanced packaging industries.

There are many DoD needs and opportunities, especially for the electronics defense industry, yet engaging with the DoD technology ecosystem can be perplexing. Don’t miss the chance to hear from the Department of Navy (DoN) Office of Small Business Programs on how to actively engage with the technology ecosystems, making connections with DoN offices, finding the opportunities, and many other defense industry base support mechanisms. Dan Sheridan is currently on rotation to the DoN Office of Small Business Programs as the “on-staff entrepreneur,” and has also served as the NAVSEA Director of Integrated Enterprise Plan. Mr. Sheridan actively engages with the defense industrial base and DoN acquisition communities to creatively overcome hurdles and ensure that our defense systems are using the best technology available.

All industry members and government are invited to join us [...]

Following a great annual meeting, our upcoming August virtual forum [...]