The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications.
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DSI’s Inaugural Assured Microelectronics Summit will bring together members of the DoD, US Government, and Industry to focus on the technologies and policies needed to enhance microelectronics capabilities in support of increased supply chain resilience & overall national security efforts. |
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